3D Interoperability for Multi-Dimensional Benefits

Sponsor:
file

Previous 2-dimensional approaches to interoperability are quickly being replaced by more advanced, benefits-enhancing 3-dimensional methods of communicating horizontally, vertically and deeply across all components of the AMI network. This white paper explains how to achieve anytime, anywhere Interconnectivity among hardware, communications and applications. 3D approaches enable improved safety, security, flexibility and reliability, along with the richer environment of data exchange and real-time information availability.

 

White Paper brought to you by Elster

Format: application/pdf PDF
File Size: 1,488Kb